求翻译：电镀是完成铜互连线的主要工艺。集成电路铜电镀工艺通常采用硫酸盐体系的电镀液,镀液由硫酸铜、硫酸和水组成,呈淡蓝色。当电源加在铜(阳极)和硅片(阴极)之间时,溶液中产生电流并形成电场。阳极的铜发生反应转化成铜离子和电子,同时阴极也发生反应,阴极附近的铜离子与电子结合形成镀在硅片表面的铜,铜离子在外加电场的作用下,由阳极向阴极定向移动并补充阴极附近的浓度损耗,如图2所示。电镀的主要目的是在硅片上沉积一层致密、无孔洞、无缝隙和其它缺陷、分布均匀的铜。是什么意思？

Very difficult to etch copper, copper interconnects with dual embedded technology, also known as the Dual Damascene process. 1) First, the deposition of a thin layer of silicon nitride (si3n4) as a diffusion barrier and etch stop layer, 2) Then, in a certain thickness of the above deposition of sili

Because of the copper etching is very difficult, and therefore uses a dual-copper interconnect embedded technology, also known as double-Damascus process. 1) FIRST deposit a thin layer of silicon nitride (Si N 3 4) as a diffusion barrier layer and etch stop layer, 2) and then in the deposition of a