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关注：1
2013-05-23 12:21
求翻译：锡球整平：通过一定压力将基板表面的锡球球面整平成为平面，以利于封装焊接。是什么意思？ 待解决
 悬赏分：1
- 离问题结束还有
锡球整平：通过一定压力将基板表面的锡球球面整平成为平面，以利于封装焊接。
问题补充： |
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2013-05-23 12:21:38
正在翻译，请等待...
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2013-05-23 12:23:18
Seok-ball flush: a certain amount of pressure through the base of the tin-plate surface smoothing, spherical ball as a plane, in order to facilitate soldered.
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2013-05-23 12:24:58
Tin ball leveling: Levels off into through certain pressure the foundation plate surface tin ball spherical surface the plane, favors the seal welding.
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2013-05-23 12:26:38
Ball leveling: the substrate surface by pressure ball spherical surface leveling of planes, to the benefit of encapsulation welding.
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2013-05-23 12:28:18
正在翻译，请等待...
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