求翻译：但随着LED芯片输入功率的大幅提高, 带来了大的发热量及要求高的出光效率, 给LED的封装技术提出了更新更高的要求, 使得功率型LED 的封装技术成为近年来的研究热点。是什么意思？

With a substantial increase in input power led chip, bringing large heat and require high light extraction efficiency, packaging technology led the newer and higher requirements, making the packaging technology of power led to a recent study hot spots.

However, as LED chip input power of the large increase in the heat of the large and high-demand, to the optical efficiency of LED encapsulation technology made a newer and higher-power requirements, making it the type of encapsulation technology LED become a hot point of research in recent years.

But enhanced largely along with the LED chip power input, has brought the great calorific capacity and requests the high optical efficiency, proposed for the LED seal technology renewed a higher request, enabled power LED the seal technology to become the recent years the research hot spot.

But as the LED chip power increase, brings a lot of heat and requires high light efficiency, LED packaging technology has made even higher demands, power LED packaging technology research in recent years.

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