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  • 匿名
关注:1 2013-05-23 12:21

求翻译:電子部品を基板に実装して実装基板を製造する電子部品実装システムは、半田接合用のペーストが印刷された後の基板を対象として、電子部品を実装する複数の部品実装装置を連結して構成されている。。是什么意思?

待解决 悬赏分:1 - 离问题结束还有
電子部品を基板に実装して実装基板を製造する電子部品実装システムは、半田接合用のペーストが印刷された後の基板を対象として、電子部品を実装する複数の部品実装装置を連結して構成されている。。
问题补充:

  • 匿名
2013-05-23 12:21:38
Electronic component mounting system to manufacture a mounting board is mounted on board electronic components, and configure the concatenation of the component mounting apparatus as multiple target the substrate after the paste for the solder joint has been printed, to implement electronic componen
  • 匿名
2013-05-23 12:23:18
Electronic components in the board mounting to implement a system to manufacture the mounting electronic components for the solder joints of the paste is printed after the Board of the electronic components to implement a consolidated multiple component mounting systems are configured. .
  • 匿名
2013-05-23 12:24:58
Mounting the electronic part on the baseplate, the electronic part mounted system which produces the mounted baseplate is formed after the paste for oolder joint is printed, connecting the plural component mounting devices which mount the electronic part the baseplate as an object.。
  • 匿名
2013-05-23 12:26:38
Electronic component mounting system board implementation of electronic components, PCB manufacturing concatenating the parts implemented industrial equipment to implementation after the paste solder for bonding of printed board electronic components for a and configured.
  • 匿名
2013-05-23 12:28:18
正在翻译,请等待...
 
 
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