求翻译：本项目以突破电路模块在SMT和微组装加工中的组装质量测控技术为目的，综合利用电检测方法与光学检测方法，提出有效的组装质量测控手段，对组装工艺提出指导意见。本项目的研究成果为组装质量测控提供技术方法，以提高组装工艺可控性、电路模块质量与可靠性，对于缩短生产周期，提高产品质量，提高电子设备的可靠性具有重要的意义。是什么意思？

The project to break the circuit modules in SMT and micro-assembly process in the assembly quality control technology for the purpose of utilization of electrical and optical detection methods detection methods, to propose effective means of assembly quality monitoring and control, guidance on the a

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This project take breaks through the electric circuit module in SMT and in the micro assembly processing assembly quality observation and control technology as a goal, the comprehensive advantage uses electricity the examination method and optics examination method, proposed the effective assembly q

This project to break the circuit modules in the Assembly quality of SMT and micro-fabrication process measurement and control technology for the purpose of comprehensive utilization of electric detecting method and optical inspection methods, put forward effective means of Assembly quality control,