求翻译：4PIN插针在焊接时受热起泡，为了解决起泡将4PIN插针的第一个塑胶向后移动7MM，焊接好后再推向线践板边沿，你所说的表面有一层薄模是塑胶推移产生的，对不起我们没有将它抹好。是什么意思？

The 4pin pins in the welding heat blistering, in order to solve the blistering move backward 4pin pins plastic 7mm, welding and then push the line practice plate edge, said surface a thin layer of mold plastic goes on generated, I'm sorry we do not have to wipe it good.

Pin 4 PIN during soldering heat blisters, blisters will be 4 in order to solve PIN pin of the first plastics to move 7 MM, soldered and practice board to line the edges, and you have said that the surface is a thin layer of plastic over time, I am sorry we do not have to wipe it out.

4PIN inserts the needle when the welding is heated bubbles, in order to solve bubbles inserts 4PIN the needle the first revertex backward to move 7MM, after welds pushes to the line to tread the flange again along, you said the surface has a thin mold is the revertex passage produces, is unfair to u

4PIN PIN during welding and heat blister, in order to solve foaming 4PIN pin of the first plastic back 7MM, welding well into line after carrying out the plate edges, what you said surface there is a thin mold of plastic over, sorry we do not have it good.

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