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关注：1
2013-05-23 12:21
求翻译：使用返修系统拆除BGA,并用烙铁将PCB焊盘残留的焊锡清除干净，使焊盘平整，是什么意思？ 待解决
 悬赏分：1
- 离问题结束还有
使用返修系统拆除BGA,并用烙铁将PCB焊盘残留的焊锡清除干净，使焊盘平整，
问题补充： |
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2013-05-23 12:21:38
Removed using Rework BGA, and PCB pad with a soldering iron will be cleaned of residual solder, so that the pad level,
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2013-05-23 12:23:18
use BGA returned for repair, and used iron removal system will PCB welding residual solder out clean up, so that welding site formation.
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2013-05-23 12:24:58
The use repair system demolishes BGA, and welds with the iron PCB the plate residual soldering tin elimination to be clean, causes to weld the plate to be smooth,
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2013-05-23 12:26:38
Using BGA rework system demolition, PCB pads with the iron residue solder clean, pad level,
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2013-05-23 12:28:18
Removed using Rework BGA, and PCB pad with a soldering iron will be cleaned of residual solder, so that the pad level,
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