求翻译：在软板与硬板复合叠层压合后固化时间不够,粘着剂没有完全定形.在经过高温时导通孔出现爆孔.从而导致电测开路不良是什么意思？

In the soft board and hard board laminated composite laminated after the curing time is not enough adhesive is not completely amorphous at high temperatures occur when blasting hole vias, thereby leading to poor electrical measuring open

After the soft GEM board complex stack laminated together with a hard after sufficient time, curing adhesives are not fully formalized when the temperature in the hole after blasting a hole which can lead to electrical testing breakers bad .

And firm compound folds the level in the soft board to press fit the postcure time to be insufficient, the tackifier does not have the complete setting. When process high temperature leads the through hole to appear explodes the hole. Thus causes the electrical measurement opening not to be good

Soft Board and the curing time after bondedto a complex stack of laminated, adhesive is not completely stabilized. after high temperature blast hole via-holes appear when. poor causing the electrical measuring circuit

In the soft board and hard board laminated composite laminated after the curing time is not enough adhesive is not completely amorphous at high temperatures occur when blasting hole vias, thereby leading to poor electrical measuring open