求翻译：铜互连是目前超大规模集成电路中的主流互连技术,而电镀铜是铜互连中的关键工艺之一。有机添加剂是铜电镀工艺中的关键因素,各种有机添加剂相互协同作用但又彼此竞争,恰当的添加剂浓度能保证良好的电镀性能。在45nm或更小特征尺寸技术代下,为得到低电阻率、无孔洞和缺陷的致密铜镀层,ALD和无种籽电镀被认为是目前最有可能的解决办法。此外,研究开发性能更高的有机添加剂也是途径之一,而使用新的电镀方式(比如脉冲电镀)也可能提高铜镀层的质量。是什么意思？

Copper interconnect mainstream interconnect technology in the current super LSI, and electroplating of copper is one of the key process in the copper interconnect. The organic additive is a key factor in the copper plating process, a variety of organic additive synergism, but compete with each other

copper interconnect is currently the mainstream VLSI interconnect technology, which is copper plated and copper interconnect technology in one of the key. Copper plating organic additive is a key factor in the process of organic additives, mutual synergies but also compete with each other, the prope

Copper Interconnects are the mainstream of current VLSI interconnect technology, and copper plating is%