求翻译：目前最有可能解决以上问题的方法是ALD和无种籽电镀。使用ALD技术能够在高深宽比结构薄膜沉积时具有100%台阶覆盖率,对沉积薄膜成份和厚度具有出色的控制能力,能获得纯度很高质量很好的薄膜。而且,有研究表明:与PVD阻挡层相比,ALD阻挡层可以降低导线电阻。因此ALD技术很有望会取代PVD技术用于沉积阻挡层。不过ALD目前的缺点是硬件成本高,沉积速度慢,生产效率低。是什么意思？

Is most likely to solve the above problem is ald and seed-free plating. Use of the ald technology can have 100% step coverage in high aspect ratio structures of thin film deposition, excellent ability to control the composition and thickness of the deposited film, to obtain high purity and good qual

At present, the most likely solve the above problem is ALD and no seed plating. Use technology to be able to highly sophisticated ALD bandwidth than structural film when you deposit with a 100% step coverage of the deposition, thin film composition and thickness with an excellent ability to control

At pres

Currently most likely to solve the above problem was ALD and seed-free plating. Using ALD technology in thin film deposition with high aspect ratio structures with 100% step coverage, on the composition and deposition film thickness with excellent control and are able to obtain very high purity is o