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关注：1
2013-05-23 12:21
求翻译：使用原子层沉积技术沉积阻挡层和铜的无种籽层电镀是目前铜互连技术的研究热点。是什么意思？ 待解决
 悬赏分：1
- 离问题结束还有
使用原子层沉积技术沉积阻挡层和铜的无种籽层电镀是目前铜互连技术的研究热点。
问题补充： |
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2013-05-23 12:21:38
No barrier and copper seed layer plating using atomic layer deposition deposited copper interconnect technology.
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2013-05-23 12:23:18
Use of the atomic layer deposition technologies sediment barrier and copper plating without seed layer is the copper interconnect technology research hot spot.
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2013-05-23 12:24:58
The use atomic shell deposits the technical deposition barrier and the copper non-seed level galvanization is the present copper interconnection technique research hot spot.
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2013-05-23 12:26:38
Using atomic layer deposition no seed layer deposition of barrier and copper plating is currently the research hotspots of copper interconnect technology.
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2013-05-23 12:28:18
use of the atomic layer deposition technologies sediment barrier and copper plating without seed layer is the copper interconnect technology research hot spot. ;
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