求翻译：除了电镀以外,还有一种无需外加电源的沉积方式,这就是化学镀。化学镀不同于电镀,它是利用氧化还原反应使金属离子被还原沉积在基板表面,其主要特点是不需要种籽层,能够在非导体表面沉积,具有设备简单、成本较低等优点。化学镀目前在集成电路铜互连技术中的应用主要有:沉积CoWP等扩散阻挡层和沉积铜种籽层。最近几年关于化学镀铜用于集成电路铜互连线以及沟槽填充的研究亦成为一大热点,有研究报道通过化学镀同样可以得到性能优良的铜镀层]。但是化学镀铜通常采用甲醛做为还原剂,存在环境污染的问题。是什么意思？

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In addition, there are also a plating method that does not require additional power of sediment, which is chemical nickel. Different from chemical nickel plating, it is to use redox reaction in the metal ion is restored deposition on a substrate surface, its main characteristic is that it does not r

Apart from electroplating, deposition of there without having the power, this is electroless plating. Electroless plating is different from electroplating, it is the use of a redox reaction to restore the metal ions are deposited on the substrate surface, its main feature is the seed layer is not re