求翻译：尽管使用有机添加剂可实现深亚微米尺寸的铜电镀,但往往会有微量的添加剂被包埋在铜镀层中。对于镀层来说,这些杂质可能会提高电阻系数,并且使铜在退火时不太容易形成大金属颗粒。是什么意思？

Despite the use of organic additives to achieve the deep sub-micron size copper plating, but there is often a small amount of additives is embedded in the copper coating. For coating, these impurities may enhance the resistivity, and copper during annealing is not easy to form large metal particles.

Although use of organic additives for deep sub-micron size of the copper plating, but it is quite often a trace amount of the additive package is buried in the copper plating. For plating, these impurities may increase resistance coefficient, and annealed in the copper is not too easy to form a larg

Although uses the organic chemical additive to be possible to realize the deep submicron size copper galvanization, but often can have the micro chemical additive by the embedding in the brass plating level.Regarding coating, these impurities possibly can enhance the resistance coefficient, and caus

Despite the use of organic additives for copper plating of deep submicron size, but micro-additives tend to have been embedded in copper plating. For coating, these impurities can increase resistance coefficient, and so the copper does not easily form in the annealed metal particles.

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