求翻译：电镀是完成铜互连线的主要工艺。集成电路铜电镀工艺通常采用硫酸盐体系的电镀液,镀液由硫酸铜、硫酸和水组成,呈淡蓝色。当电源加在铜(阳极)和硅片(阴极)之间时,溶液中产生电流并形成电场。阳极的铜发生反应转化成铜离子和电子,同时阴极也发生反应,阴极附近的铜离子与电子结合形成镀在硅片表面的铜,铜离子在外加电场的作用下,由阳极向阴极定向移动并补充阴极附近的浓度损耗。电镀的主要目的是在硅片上沉积一层致密、无孔洞、无缝隙和其它缺陷、分布均匀的铜。是什么意思？

Electroplating is the main process to complete the copper interconnect lines. IC copper plating process is usually sulfate system, the plating solution bath of copper sulfate, sulfuric acid and water, pale blue. When power is applied between the copper (anode) and silicon (cathode) current and the f

Copper plating is complete the main interconnect lines. IC copper electroplating process is often used for plating fluid system sulphate, sulfuric acid copper plating solution and water, sulfuric acid, is pale blue. When the power supply in the copper (Anode) and silicon (cathode) is the current sol