求翻译：因D ICY 与环氧树脂的相容性差，易导致固化反应不均匀，在半固化浸渍胶物中有双氰胺析出；而且制得的印刷电路板软化点低，在内层电路板机钻加工时容易产生较厚的树脂附着层。是什么意思？

D icy and epoxy resin compatibility, easily lead to uneven curing reaction, prepreg impregnated plastic material dicyandiamide precipitation; and the printed circuit board system of low softening point, in the inner layer circuit board machine drill prone processing of thick resin adhesion layer.

Due to the epoxy resin D ICY compatibility of the poor, and easy-to-result in curing reaction is not uniform, in a semi-curing impregnated with plastic in a double-melamine gelation system; and the printed circuit board, and the softening point of low-level circuit board drilling machine is easier t

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D poor compatibility of epoxy resin and ICY, easily lead to uneven curing, in semi-impregnated plastic real dicyandiamide curing precipitation; low softening point and making printed circuit boards, in the inner layer circuit board drilling and processing that is easy to produce thick resin substrat

正在翻译，请等待...