求翻译：由于金属或半导体熔融液滴与周围气体的密度比相当高，目前还没有见到相场法模拟金属或半导体液滴内部对流和界面变形过程的报道，是什么意思？

Metal or semiconductor melt droplets with the surrounding gas density is quite high, have not seen the reports of the phase field simulation of metal or semiconductor droplet internal convection and interface deformation process.

Due to metal or semiconductor molten droplets with the surrounding gas density than was quite high, there is no law to see that a metal or semiconductor analog internal convection drops and the interface of the deformation process,

Because the metal or the semiconductor fuse the bubble with the periphery gas density compared to quite high, at present has not seen the field law simulation metal or the semiconductor bubble interior convection and the contact surface distortion process report,

Due to a metal or semiconductor melt droplets and ambient gas density is quite high, we have not yet seen droplet phase-field simulation of metal or semiconductor reports of internal convection and interfacial deformation process,

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