求翻译：推测为静电的防护措施不到位，静电击穿芯片导致。根本原因还请客户将不良实物退回，我司对产品进行确认，并深入分析后才能制定纠防措施。是什么意思？

Speculate that the electrostatic protection measures in place, the electrostatic breakdown chip lead. The fundamental reason please the customers will return bad kind, the Division I confirm, and in-depth analysis to develop correct preventive measures.

Assumed to be static protective measures were not in place, static electricity arcing chip lead. Also ask for the customer's underlying causes adverse physical return to division I for the product to confirm, and in-depth analysis can only be developed after error correction defense measures.

The extrapolation does not arrive for the static electricity protective measure, the static electricity puncture chip causes.The basic reason will also ask the customer not the good material object to return, I will take charge of to the product carry on the confirmation, after and the thorough anal

Speculation for electrostatic protective measures are not in place, electrostatic breakdown chip lead. Root cause the customer return the bad kind, our company to confirm the product, and after an in-depth analysis in order to develop correct control.

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