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关注：1
2013-05-23 12:21
求翻译：引线键合作为半导体生产后道工序中的关键，在未来相当长一段时间内仍将是封装内部连接的主流方式。是什么意思？ 待解决
 悬赏分：1
- 离问题结束还有
引线键合作为半导体生产后道工序中的关键，在未来相当长一段时间内仍将是封装内部连接的主流方式。
问题补充： |
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2013-05-23 12:21:38
Lead bonding is the key in the future for a long period of time after the procedure in the semiconductor manufacturing will continue to be the mainstream way of the package is internally connected.
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2013-05-23 12:23:18
lead to cooperation for the semiconductor production processes after the key to the future in a very long period of time will be encapsulated within the mainstream form attached.
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2013-05-23 12:24:58
The lead wire linkage after took the semiconductor production in the working procedure key, quite will be long in the future in period of time still will be seals internal connection the mainstream way.
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2013-05-23 12:26:38
After wire bonding for semiconductor manufacturing in cooperation key in the process, will remain for quite a long time to come is a mainstream way to encapsulate internal connections.
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2013-05-23 12:28:18
正在翻译，请等待...
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