求翻译：在高温高压状态下烧结成一个整体。其形状是一个中心有孔的圆片（Φ25mm×Φ3.2mm×2.6mm）。多层组合一体化压电陶瓷芯片就是压电加速度地震检波器的核心器件。是什么意思？

Sintered at high temperature and pressure conditions as a whole. Its shape is a center hole of the wafer (Φ25mm × Φ3.2mm × 2.6mm). Integration of piezoelectric ceramic multi-layer piezoelectric accelerometer chip is the core of geophone components.

under high pressure and temperature condition burned into an integrated whole. its shape is a center of wafers (Φ perforated 25 mm x 3.2 mm x 2.6 mm Φ). Multi-layer integration piezoelectric ceramic chip is piezoelectric accelerometer geophone core devices.

The agglutination becomes a whole under the high temperature high pressure condition.Its shape is a center has the hole disk (φ25mm×Φ3.2mm×2.6mm).The multi-layered combination integration piezoelectricity ceramics chip is the piezoelectricity acceleration geophone core component.

Under high temperature and high pressure state burnt to form a whole. Its shape is the central hole of wafer (25mmx φ 3.2mmx2.6mm). Integration of multilayer composite Piezoelectric ceramic chip is the core component of piezoelectric acceleration geophone.

Burn and form a whole in high-temperature and high-pressure condition. Its shape is round slice (Φ 25mm *Φ 3.2mm *2.6mm) with hole of a centre. It is a key device of the piezo-electric acceleration geophone that the multilayer makes up the integrated piezoelectric ceramic chip.