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关注：1
2013-05-23 12:21
求翻译：The attached picture shows that the silver tape, on the corner of the screen where the chip and crack is (under the silver tape), has been crumpled farther back than the chip itself and re-stuck. I think that this means that the damage occurred in the plant.是什么意思？ 待解决
 悬赏分：1
- 离问题结束还有
The attached picture shows that the silver tape, on the corner of the screen where the chip and crack is (under the silver tape), has been crumpled farther back than the chip itself and re-stuck. I think that this means that the damage occurred in the plant.
问题补充： |
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2013-05-23 12:21:38
所附图片显示银胶带，芯片和裂纹（下银磁带）屏幕的角落，已经皱巴巴的更远比芯片本身并重新卡住。我认为，这意味着在工厂发生的损害。
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2013-05-23 12:23:18
所附的图示,银磁带,屏幕的角落的芯片和打击是(在银色磁带),已弄皱远比该芯片本身和重新坚持。 我认为,这意味着损害发生在该厂。
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2013-05-23 12:24:58
附上图片表示，银色磁带，在屏幕的角落，芯片和裂缝(在银色磁带之下)，比芯片是被弄皱的更远的后面和再陷进。 我认为这意味着损伤在植物中发生了。
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2013-05-23 12:26:38
附加的图片显示已被压垮远回比芯片本身并 re-stuck 银磁带，角的芯片和裂缝是 （根据银磁带），在屏幕上。我认为这意味着在损害发生中的植物。
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2013-05-23 12:28:18
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