求翻译：近年来，电路模块组装密度大幅度增加，在组装形式上，出现了高密度立体组装、叠层组装、微组装等多种复杂组装形式。在电气连接方式上，出现了从焊点连接到凸点连接、柔性连接、引线键合等多种连接方式的转变。组装过程中产生的连接点故障及电气故障等是影响电路模块组装质量的突出因素，而传统的测试方法已经不能适应，从而为解决组装质量测控问题提出了新的需求。研究组装质量测控方法及手段，成为当前急需解决的问题。是什么意思？

In recent years, a significant increase in the density circuit module assembly, the assembly form, the emergence of high-density three-dimensional assembly, laminated assembly, micro-assembly and other forms of complex assembly. In the electrical connection, there has been connected to the bump from

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In recent years, the electric circuit module packing density large scale increase, in the assembly form, appeared the high density three-dimensional assembly, has fo

In recent years, the circuit module Assembly density increased considerably in assembled form, high-density stereo Assembly occurred, laminated Assembly, micro Assembly, and other complex assembled form. On the electrical connection, emerged from the solder connection to bump connections, flexible c