求翻译：众多集成封装产品散热结构存在着很大的缺陷，中心封闭不通透，使得热空气无法交换对流，无法达到芯片正常工作时的散热目的，当芯片（半导体材料）不断产生热量而得不到有效的解决，就会出现严重光衰（使用三个月或半年就会出现严重的光衰，甚至烧坏），严重影响芯片使用寿命是什么意思？

Thermal structure of a number of integrated packages there are significant flaws, the center closed are not transparent, making the hot air convection can not be exchanged, the chip can not achieve the purpose of heat during normal operation, when the chip (semiconductor materials) continue to produ

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The multitudinous integrated seal product radiation structure has the very big flaw, the central seal is not insightful, causes the hot air to be unable to exchange the convection, is unable achieves when the chip normal work radiation goal, when the chip (semiconducting material) has the quantity o

Many integrated package products thermal structure exists with is large of defects, Center closed does not permeability, makes hot air cannot exchange convection, cannot reached chip normal work Shi of thermal purpose, dang chip (semiconductor material) constantly produced heat and was does not to e

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