|
关注：1
2013-05-23 12:21
求翻译：Sputter deposition is a physical vapor deposition (PVD) method of depositing thin films that is ejecting, material from a "target," that is source, which then deposits onto a "substrate," such as a silicon wafer. Resputtering is re-emission of the deposited material during the deposition process by ion or atom bombar是什么意思？ 待解决
 悬赏分：1
- 离问题结束还有
Sputter deposition is a physical vapor deposition (PVD) method of depositing thin films that is ejecting, material from a "target," that is source, which then deposits onto a "substrate," such as a silicon wafer. Resputtering is re-emission of the deposited material during the deposition process by ion or atom bombar
问题补充： |
|
2013-05-23 12:21:38
溅射沉积是从一个“目标”，即源，沉积薄膜弹出，材料物理气相沉积（PVD）方法，然后到“基材”，如硅片的存款。 Resputtering沉积在沉积过程中离子或原子轰击材料的再次发射。
|
|
2013-05-23 12:23:18
溅射是物理蒸气喷镀(PVD)的方法,是将交存薄膜,材料由一个“目标”,是源,然后把存款"衬底”,例如一间晶圆。 resputtering是重新排放的材料存放在该书面供词过程离子或原子的轰炸。
|
|
2013-05-23 12:24:58
正在翻译，请等待...
 |
|
2013-05-23 12:26:38
溅射沉积是物理气相沉积 （PVD） 方法沉积弹出，从"目标，"材料的薄膜材料的是源，它然后存款到"底"，如硅晶片。Resputtering 是 re-emission 沉积物质的原子或离子轰击沉积过程中。
|
|
2013-05-23 12:28:18
溅射沉积是从一个“目标”，即源，沉积薄膜弹出，材料物理气相沉积（PVD）方法，然后到“基材”，如硅片的存款。 Resputtering沉积在沉积过程中离子或原子轰击材料的再次发射。
|
湖北省互联网违法和不良信息举报平台 | 网上有害信息举报专区 | 电信诈骗举报专区 | 涉历史虚无主义有害信息举报专区 | 涉企侵权举报专区
