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关注：1
2013-05-23 12:21
求翻译：微处理器针脚及封装联接所使用的含两种以上组分的焊料中的铅（铅含量在80%与85%之间）是什么意思？ 待解决
 悬赏分：1
- 离问题结束还有
微处理器针脚及封装联接所使用的含两种以上组分的焊料中的铅（铅含量在80%与85%之间）
问题补充： |
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2013-05-23 12:21:38
Microprocessor used in connection pins and the package containing two or more components of lead solder (lead content of between 80% and 85%)
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2013-05-23 12:23:18
Microprocessor pin and the packaging used in connection with two or more components of lead in the solder (lead content in between 80 per cent and 85 per cent)
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2013-05-23 12:24:58
The microprocessor needle foot and the seal joint uses contains in two kind of above component solder lead (lead content between 80% and 85%)
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2013-05-23 12:26:38
Join microprocessor pins and packaging by the use of lead in solder containing more than two components (lead content between and 80%)
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2013-05-23 12:28:18
Join microprocessor pins and packaging by the use of lead in solder containing more than two components (lead content between and 80%)
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