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关注：1
2013-05-23 12:21
求翻译：Wafers or semiconducting substrates bonding method for manufacture of backside-illuminated imager, involves propagating bonding wave from point of pressure applied on wafer, and propagating another wave over zone placed in vicinity of point是什么意思？ 待解决
 悬赏分：1
- 离问题结束还有
Wafers or semiconducting substrates bonding method for manufacture of backside-illuminated imager, involves propagating bonding wave from point of pressure applied on wafer, and propagating another wave over zone placed in vicinity of point
问题补充： |
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2013-05-23 12:21:38
晶片或半导体衬底键合方法制造背面照式成像仪，包括传播粘接波从点的压力施加在晶片上，并传播一拨过区放置在点附近
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2013-05-23 12:23:18
结合后侧方有启发性印象制造的薄酥饼或半导体的基体方法，介入繁殖从在薄酥饼的压力应用的问题的接合波浪和繁殖在点近处安置的区域的另一波浪
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2013-05-23 12:24:58
正在翻译，请等待...
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2013-05-23 12:26:38
晶片或半导体基板粘接的背面照明成像仪，制造方法涉及传播粘接波从外延片、 上应用的压力点，将另一波传播在区放置在附近的点
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2013-05-23 12:28:18
正在翻译，请等待...
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