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关注：1
2013-05-23 12:21
求翻译：1. Gold deposit along the edges of PCB : Due to this PN are with castellations on the edge of PCB, the production processes are designed : Plating—Routing inside slot—Etching , the castellations burrs produced by routing can be etched off by etching at the same time ，but in actual producing ,plating operator didn’t ha是什么意思？ 待解决
 悬赏分：1
- 离问题结束还有
1. Gold deposit along the edges of PCB : Due to this PN are with castellations on the edge of PCB, the production processes are designed : Plating—Routing inside slot—Etching , the castellations burrs produced by routing can be etched off by etching at the same time ，but in actual producing ,plating operator didn’t ha
问题补充： |
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2013-05-23 12:21:38
1。黄金沿PCB边缘存款：由于此PN与PCB边缘castellations是，生产过程的设计：内槽刻蚀镀路由，毛刺castellations路由产生，可以在相同的蚀刻蚀刻关闭时间，但在实际生产中，电镀运营商并未有一个良好的MI外观和安排后面板电镀蚀刻直接，所以castellations毛刺需要返工删除的，返工过程包括PTH过程，但错过了钝化钯，所以镍和金沉积随着PCB的边缘;（返工工艺是内槽刻蚀PTH镀锡路由 - 消除锡）
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2013-05-23 12:23:18
1.
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2013-05-23 12:24:58
1. Gold deposit along the edges of PCB: Due to this PN are with castellations on the edge of PCB, the production processes are designed: Plating—Routing inside slot—Etching , the castellations burrs produced by routing can be etched off by etching at the same time ，but in actual producing ,plating o
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2013-05-23 12:26:38
1. Gold deposit along the edges of PCB : Due to this PN are with castellations on the edge of PCB, the production processes are designed : Plating—Routing inside slot—Etching , the castellations burrs produced by routing can be etched off by etching at the same time ，but in actual producing ,plating
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2013-05-23 12:28:18
正在翻译，请等待...
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